Vertical device and method of forming the same

ABSTRACT

According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes the following operations: providing a vertical structure over a substrate; forming a first dielectric layer over the vertical structure and the substrate; laterally etching a sidewall of the first dielectric layer; replacing a portion of the first dielectric layer over the vertical structure with a second dielectric layer; and etching a portion of the first dielectric layer to expose the lateral surface of the vertical structure.

BACKGROUND

In the advanced technology, it is a challenge to etch-back metal gatesduring manufacturing semiconductor devices due to no selectivity betweensalicide and metal gates. Therefore, there is a need to deal with saidetch-back and facilitate the manufacture of the semiconductor devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment.

FIG. 2 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 3 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 4 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 5 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 6 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 7 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 8 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 9 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 10 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 11 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment.

FIG. 12 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 13 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 14 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 15 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 16 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 17 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 18 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 19 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 20 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 21 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 22 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 23 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment.

FIG. 24 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 25 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 26 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 27 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 28 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 29 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 30 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 31 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 32 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 33 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 34 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment.

FIG. 35 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment.

FIG. 36 is a flow chart for forming a vertical device according to anexemplary embodiment.

FIG. 37 is a flow chart for forming a vertical device according to anexemplary embodiment.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The disclosure describes a self-aligned method which may form a hardmask on the top of a vertical structure as a stop layer to protectunderlying layers for subsequent processes, for example, forming andpatterning work function metal layers or metal gate layers. It can beimplemented in any process flow such as vertical gate-all-around (VGAA),and may require less stringent lithography process.

The method may be realized by several VGAA procedures, including (1) toprovide a vertical structure having a source layer, a channel layer anda drain layer, then to provide a hard mask formed of a dielectric layerover the vertical structure, further to remove the hard mask and to forma gate layer substantially surrounding the channel layer; (2) to providea vertical structure having a source layer and a channel layer, then toprovide a hard mask formed of a dielectric layer over the verticalstructure, further to remove the hard mask, to form a drain layer overthe channel layer and to form a gate layer substantially surrounding thechannel layer.

The hard mask formed of the dielectric layer may protect the layers inthe vertical structure, for example, salicide metal formed of Ti or TiN,during a metal gate etch back process (MGEB) in the VGAA procedures.Additionally, the source layer, the channel layer and the drain layer ofthe VGAA may be formed of Si, SiGe, Ge, III-V(InP, GaAs, AlAs, InAs,InAlAs, InGaAs, InSb, GaSb, InGaSb) and the said materials with a n-typedopant or a p-type dopant.

FIG. 1 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 1, asemiconductor device 100 is provided. In the semiconductor device 100, afirst vertical structure 110 is provided over a substrate 101. The firstvertical structure 110 may be a vertical-gate-all-around device. Thefirst vertical structure 110 may be a PMOS or a NMOS. Additionally, adielectric layer 102 may be formed over the substrate 101.

FIG. 2 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 2, afirst dielectric layer 202 is formed over the vertical structure 110 andthe substrate 101. The first dielectric layer 202 may be formed of atleast one of oxide, SiN, SiON, SiC, SiCN and SiOCN. The first dielectriclayer 202 may have a thickness of about 5-40 nanometers.

FIG. 3 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 3,sidewalls 302, 303 of the first dielectric layer 202 are trimmed by alateral etching process. In the lateral etching process, a polymer layer(not shown) may be formed over the portion 304 of the first dielectriclayer 202 above the top of the vertical structure 110 by using a polymergas, and the sidewalls 302, 303 of the first dielectric layer 202 arerespectively laterally etched with lateral plasma power 306, 307.

Continuing from FIG. 3, details of the procedure of replacing a portionof the first dielectric layer 202 over the vertical structure 110 with asecond dielectric layer will be described in FIGS. 4-9 hereafter.

FIG. 4 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 4, afirst film layer 402 is formed over the first dielectric layer 202. Thefirst film layer 402 may be formed of at least one of poly and anashable amorphous carbon film.

FIG. 5 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 5, achemical mechanical polishing is performed on the first film layer 402and stops on the first dielectric layer 202.

FIG. 6 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 6, a wetetching process is performed on a portion of the first dielectric layer202 to expose a top surface 602 of the vertical structure 110 and toform a recess 604.

FIG. 7 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 7, asecond dielectric layer 702 is formed over the first film layer 402 andin the recess 604. The second dielectric layer 702 may be formed of atleast one of oxide, SiN, SiON, SiC, SiCN and SiOCN.

FIG. 8 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 8, achemical mechanical polishing is performed on the second dielectriclayer 702 and stops on the first film layer 402.

FIG. 9 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 9, a wetetching process is performed on the first film layer (not shown) toexpose the first dielectric layer 202.

FIG. 10 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 10, a wetetching process is performed on the first dielectric layer (not shown)to expose the lateral surface 1002 of the vertical structure 110. Assuch, the second dielectric layer 702 is formed on the top of thevertical structure 110. The second dielectric layer 702 is self-alignedto the vertical structure 110 and may be formed as a hard mask on thetop of the vertical structure 110 to protect underlying layers forsubsequent processes, for example, forming and patterning work functionmetal layers or metal gate layers. Furthermore, by using a properetchant, the hard mask may be easily removed by a wet etching process.

FIG. 11 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 11, asemiconductor device 1100 is provided. In the semiconductor device 1100,a first vertical structure 1110 and a second vertical structure 1120 areprovided over a substrate 1101. The first vertical structure 1110 andthe second vertical structure 1120 may be vertical-gate-all-arounddevices electrically isolated by a shallow trench isolation 1102. Thefirst vertical structure 1110 may be a PMOS, and may include an n-well1111, a first source 1112, a first channel 1113 and a first drain 1114.The second vertical structure 1120 may be a NMOS, and may include ap-well 1121, a second source 1122, a second channel 1123 and a seconddrain 1124. Salicides 1115, 1116, 1125, 1126 are used to reduce contactresistance.

The first source 1112 may be disposed over the n-well 1111. The firstchannel 1113 may be disposed over the first source 1112. The first drain1114 may be disposed over the first channel 1113. The second source 1122may be disposed over the p-well 1121. The second channel 1123 may bedisposed over the second source 1122. The second drain 1124 may bedisposed over the second channel 1123. The following procedures may beperformed on the first vertical structure 1110 and the second verticalstructure 1120, and the details for the second vertical structure 1120is not repeated herein.

FIG. 12 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 12, anetch stop layer 1202 is formed over the first vertical structure 1110and the second vertical structure 1120. The etch stop layer 1202 may beformed of SiN. The etch stop layer 1202 may have a thickness of about5-40 nanometers.

FIG. 13 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 13,sidewalls 1302, 1303 of the etch stop layer 1202 are trimmed by alateral etching process. In the lateral etching process, a polymer layer(not shown) may be formed over the portion 1304 of the etch stop layer1202 above the top of the first vertical structure 1110 by using apolymer gas, and the sidewalls 1302, 1303 of the etch stop layer 1202are respectively laterally etched with lateral plasma power 1306, 1307.

FIG. 14 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 14, afirst oxide layer 1402 is formed over the etch stop layer 1202. Then, achemical mechanical polishing is performed on the first oxide layer 1402and stops on the etch stop layer 1202.

FIG. 15 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 15, a dryetching back process a wet etching is performed on the first oxide layer1402. The remaining portion of the first oxide layer 1402 is used as abottom isolation layer.

FIG. 16 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 16, afirst film layer 1602 is formed over the first oxide layer 1402 and theetch stop layer 1202. The first film layer 1602 may be formed of atleast one of poly and an ashable amorphous carbon film.

FIG. 17 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 17, achemical mechanical polishing is performed on the first film layer 1602and stops on the etch stop layer 1202.

FIG. 18 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 18, a wetetching process is performed on a portion of the etch stop layer 1202 toexpose a top surface 1802 of the first vertical structure 1110.

FIG. 19 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 19, asecond oxide layer 1902 is formed over the first film layer 1602 and thefirst vertical structure 1110.

FIG. 20 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 20, achemical mechanical polishing is performed on the second oxide layer1902 and stops on the first film layer 1602.

FIG. 21 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 21, a wetetching process is performed on the first film layer (not shown) toexpose the sidewalls 1302, 1303 of the etch stop layer 1202 and thefirst oxide layer 1402.

FIG. 22 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 22, a wetetching process is performed on the sidewalls (not shown) of the etchstop layer 1202 to expose the lateral surface 2202 of the verticalstructure 1110. As such, the second oxide layer 1902 is formed on thetop of the vertical structure 1110. The second oxide layer 1902 isself-aligned to the vertical structure 1110 and may be formed as a hardmask on the top of the vertical structure 1110 to protect underlyinglayers for subsequent processes, for example, forming and patterningwork function metal layers or metal gate layers. Furthermore, by using aproper etchant, the hard mask may be easily removed by a wet etchingprocess.

FIG. 23 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 23, asemiconductor device 2300 is provided. In the semiconductor device 2300,a first vertical structure 2310 and a second vertical structure 2320 areprovided over a substrate 2301. The first vertical structure 2310 andthe second vertical structure 2320 may be vertical-gate-all-arounddevices electrically isolated by a shallow trench isolation 2302. Thefirst vertical structure 2310 may be a PMOS, and may include an n-well2311, a first source 2312 and a first channel 2313. The second verticalstructure 2320 may be a NMOS, and may include a p-well 2321, a secondsource 2322 and a second channel 2323. Salicides 2316, 2326 are used toreduce contact resistance.

The first source 2312 may be disposed over the n-well 2311. The firstchannel 2313 may be disposed over the first source 2312. The secondsource 2322 may be disposed over the p-well 2321. The second channel2323 may be disposed over the second source 2322. The followingprocedures may be performed on the first vertical structure 2310 and thesecond vertical structure 2320, and the details for the second verticalstructure 2320 is not repeated herein.

FIG. 24 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 24, anetch stop layer 2402 is formed over the first vertical structure 2310and the second vertical structure 2320. The etch stop layer 2402 may beformed of SiN. The etch stop layer 2402 may have a thickness of about5-40 nanometers.

FIG. 25 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 25,sidewalls 2502, 2503 of the etch stop layer 2402 are trimmed by alateral etching process. In the lateral etching process, a polymer layer(not shown) may be formed over the portion 2504 of the etch stop layer2402 above the top of the first vertical structure 2310 by using apolymer gas, and the sidewalls 2502, 2503 of the etch stop layer 2402are respectively laterally etched with lateral plasma power 2506, 2507.

FIG. 26 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 26, afirst oxide layer 2602 is formed over the etch stop layer 2402. Then, achemical mechanical polishing is performed on the first oxide layer 2602and stops on the etch stop layer 2402.

FIG. 27 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 27, a dryetching back process is performed on the first oxide layer 2602. Theremaining portion of the first oxide layer 2602 is used as a bottomisolation layer.

FIG. 28 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 28, afirst film layer 2802 is formed over the first oxide layer 2602 and theetch stop layer 2402. The first film layer 2802 may be formed of atleast one of poly and an ashable amorphous carbon film.

FIG. 29 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 29, achemical mechanical polishing is performed on the first film layer 2802and stops on the etch stop layer 2402.

FIG. 30 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 30, a wetetching process is performed on a portion of the etch stop layer 2402 toexpose a top surface 3002 of the first vertical structure 2310.

FIG. 31 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 31, asecond oxide layer 3102 is formed over the first film layer 2802 and thefirst vertical structure 2310.

FIG. 32 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 32, achemical mechanical polishing is performed on the second oxide layer3102 and stops on the first film layer 2802.

FIG. 33 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 33, a wetetching process is performed on the first film layer (not shown) toexpose the sidewalls 2502, 2503 of the etch stop layer 2402 and thefirst oxide layer 2602.

FIG. 34 is a sectional view illustrating the exemplary semiconductordevice according to the exemplary embodiment. As shown in FIG. 34, a wetetching process is performed on the sidewalls (not shown) of the etchstop layer 2402 to expose the lateral surface 3402 of the verticalstructure 2310. As such, the second oxide layer 3102 is formed on thetop of the vertical structure 2310. The second oxide layer 3102 isself-aligned to the vertical structure 2310 and may be formed as a hardmask on the top of the vertical structure 2310 to protect underlyinglayers for subsequent processes, for example, forming and patterningwork function metal layers or metal gate layers. Furthermore, by using aproper etchant, the hard mask may be easily removed by a wet etchingprocess.

FIG. 35 is a sectional view illustrating an exemplary semiconductordevice according to an exemplary embodiment. As shown in FIG. 35, a chip3500 is provided. In the chip 3500, a first vertical device 3510 havinga first threshold and a second vertical device 3520 having a secondthreshold are provided over a substrate 3501. The first vertical device3510 and the second vertical device 3520 may be electrically isolated bya shallow trench isolation 3502. The first vertical device 3510 may be aPMOS, and may include a n-well 3511, a first source 3512, a firstchannel 3513, a first drain 3514, a first gate 3531 and a first high-kdielectric layer 3533. The second vertical device 3520 may be a NMOS andmay include a p-well 3521, a second source 3522, a second channel 3523,a second drain 3524, a second gate 3541 and a second high-k dielectriclayer 3543. Salicides 3515, 3516, 3525, 3526 are used to reduce contactresistance.

The first source 3512 may be disposed over the n-well 3511. The firstchannel 3513 may be disposed over the first source 3512. The first drain3514 may be disposed over the first channel 3513. The second source 3522may be disposed over the p-well 3521. The second channel 3523 may bedisposed over the second source 3522. The second drain 3524 may bedisposed over the second channel 3523. A silicon nitride layer 3503 asan insulator may be disposed over the first source 3512, the secondsource 3522 and the shallow trench isolation 3502. An oxide layer 3504may be disposed over the silicon nitride layer 3503.

The first high-k dielectric layer 3533 may be disposed between the firstgate 3531 and the first channel 3513, and the second high-k dielectriclayer 3543 may be disposed between the second gate 3541 and the secondchannel 3523.

For the first vertical device 3510, the first source 3512 has a firstprotrusion 3561 and a first base 3562. A first trimmed portion 3551 ofthe silicon nitride layer 3503 is adjacent to the first protrusion 3561.A first untrimmed portion 3552 of the silicon nitride layer 3503 isformed over the first base 3562. The first channel 3513 is formed overthe first protrusion 3561 of the first source 3512. The first drain 3514is formed over the first channel 3513.

For the second vertical device 3520, the second source 3522 has a secondprotrusion 3571 and a second base 3572. A second trimmed portion 3553 ofthe silicon nitride layer 3554 is adjacent to the second protrusion3571. A second untrimmed portion 3554 of the silicon nitride layer 3503is formed over the second base 3572. The second channel 3523 is formedover the second protrusion 3571 of the second source 3522. The seconddrain 3524 is formed over the second channel 3523.

FIG. 36 is a flow chart for forming a vertical device according to anexemplary embodiment. As shown in FIG. 36, a method 3600 is provided.The method 3600 includes the following operations: providing a verticalstructure over a substrate (3602); forming a first dielectric layer overthe vertical structure and the substrate (3604); laterally etching asidewall of the first dielectric layer (3606); replacing a portion ofthe first dielectric layer over the vertical structure with a seconddielectric layer (3608); and etching a portion of the first dielectriclayer to expose the lateral surface of the vertical structure (3610).

The operation 3608 of replacing the portion of the first dielectriclayer over the vertical structure with the second dielectric layer mayfurther include the following operations: forming a first film layerover the first dielectric layer; performing chemical mechanicalpolishing on the first film layer and stopping on the first dielectriclayer; etching a portion of the first dielectric layer to expose a topsurface of the vertical structure and to form a recess; forming thesecond dielectric layer over the first film layer and in the recess;performing chemical mechanical polishing on the second dielectric layerand stopping on the first film layer; and etching the first film layer.The operation of forming the first film layer over the first dielectriclayer may include: forming the first film layer with at least one ofpoly and an ashable amorphous carbon film. The operation of forming thesecond dielectric layer over the first film layer and in the recess mayinclude: forming the second dielectric layer with at least one of oxide,SiN, SiON, SiC, SiCN and SiOCN.

In the exemplary embodiment, the method 3600 may include: forming athird dielectric layer over the substrate. In the exemplary embodiment,the operation 3606 of laterally etching the sidewall of the firstdielectric layer may further include: forming a polymer layer over aportion of the first dielectric layer above a top of the verticalstructure by using a polymer gas; and laterally etching the sidewall ofthe first dielectric layer by using a plasma etching process with alateral power.

In the exemplary embodiment, the operation 3604 of forming the firstdielectric layer over the vertical structure and the substrate furthercomprises: forming the first dielectric layer with at least one ofoxide, SiN, SiON, SiC, SiCN and SiOCN. In the exemplary embodiment, theoperation 3604 of forming the first dielectric layer over the verticalstructure and the substrate further comprises: forming the firstdielectric layer having a thickness of 5-40 nanometers.

In the exemplary embodiment, the operation 3602 of providing thevertical structure over the substrate may include: providing thevertical structure having a source layer and a channel layer. In theexemplary embodiment, the operation 3604 of providing the verticalstructure over the substrate may include: providing the verticalstructure having a source layer, a drain layer and a channel layer.

FIG. 37 is a flow chart for forming a vertical device according to anexemplary embodiment. As shown in FIG. 37, a method 3700 is provided.The method 3700 includes the following operations: providing a verticalstructure over a substrate (3702); forming an etch stop layer over thevertical structure (3704); laterally etching a sidewall of the etch stoplayer (3706); forming a first oxide layer over the etch stop layer(3708); performing chemical mechanical polishing on the first oxidelayer and stopping on the etch stop layer (3710); performing dry etchingback process on the first oxide layer and the remaining portion of thefirst oxide layer being used as a bottom isolation layer (3712); forminga first film layer over the first oxide layer and the etch stop layer(3714); performing chemical mechanical polishing on the first film layerand stopping on the etch stop layer (3716); etching a portion of theetch stop layer to expose a top surface of the vertical structure(3718); forming a second oxide layer over the vertical structure and thefirst film layer (3720); performing chemical mechanical polishing on thesecond oxide layer and stopping on the first film layer (3722); etchingthe first film layer (3724); and etching a portion of the etch stoplayer to expose the lateral surface of the vertical structure (3726).

In the exemplary embodiment, the operation 3706 of laterally etching thesidewall of the etch stop layer may include: forming a polymer layerover a portion of the etch stop layer above the top of the verticalstructure by using a polymer gas; and laterally etching the sidewall ofthe etch stop layer by using a plasma etching process with a lateralpower. In the exemplary embodiment, the operation 3704 of forming theetch stop layer over the vertical structure may include: forming theetch stop layer with SiN.

In the exemplary embodiment, the operation 3712 of forming the firstfilm layer over the first oxide layer and the etch stop layer mayinclude: forming the first film layer with at least one of poly andashable amorphous carbon film. In the exemplary embodiment, theoperation 3704 of forming the etch stop layer over the verticalstructure may include: forming the etch stop layer having a thickness of5-40 nanometers.

In the exemplary embodiment, the operation 3702 of providing thevertical structure over the substrate may include: providing thevertical structure having a source layer and a channel layer. In theexemplary embodiment, the operation 3702 of providing the verticalstructure over the substrate may include: providing the verticalstructure having a source layer, a drain layer and a channel layer.

According to an exemplary embodiment, a method of forming a verticaldevice is provided. The method includes the following operations:providing a vertical structure over a substrate; forming a firstdielectric layer over the vertical structure and the substrate;laterally etching a sidewall of the first dielectric layer; replacing aportion of the first dielectric layer over the vertical structure with asecond dielectric layer; and etching a portion of the first dielectriclayer to expose the lateral surface of the vertical structure.

According to an exemplary embodiment, a method of forming a verticaldevice is provided. The method includes the following operations:providing a vertical structure over a substrate; forming an etch stoplayer over the vertical structure; laterally etching a sidewall of theetch stop layer; forming a first oxide layer over the etch stop layer;performing chemical mechanical polishing on the first oxide layer andstopping on the etch stop layer; etching back the first oxide layer;forming a first film layer over the first oxide layer and the etch stoplayer; performing chemical mechanical polishing on the first film layerand stopping on the etch stop layer; etching a portion of the etch stoplayer to expose a top surface of the vertical structure; forming asecond oxide layer over the vertical structure and the first film layer;performing chemical mechanical polishing on the second oxide layer andstopping on the first film layer; etching the first film layer; andetching a portion of the etch stop layer to expose the lateral surfaceof the vertical structure.

According to an exemplary embodiment, a vertical device is provided. Thevertical device includes a source layer having a protrusion, a trimmedlayer adjacent to the protrusion, a channel layer over the protrusion ofthe source, and a drain layer over the channel layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of forming a vertical device,comprising: providing a vertical structure over a substrate; forming afirst dielectric layer over the vertical structure and the substrate;laterally etching a sidewall of the first dielectric layer; replacing aportion of the first dielectric layer over the vertical structure with asecond dielectric layer; and etching a portion of the first dielectriclayer to expose the lateral surface of the vertical structure.
 2. Themethod of claim 1, wherein replacing the portion of the first dielectriclayer over the vertical structure with the second dielectric layerfurther comprises: forming a first film layer over the first dielectriclayer; performing chemical mechanical polishing on the first film layerand stopping on the first dielectric layer; etching a portion of thefirst dielectric layer to expose a top surface of the vertical structureand to form a recess; forming the second dielectric layer over the firstfilm layer and in the recess; performing chemical mechanical polishingon the second dielectric layer and stopping on the first film layer; andetching the first film layer.
 3. The method of claim 1, whereinlaterally etching the sidewall of the first dielectric layer furthercomprises: forming a polymer layer over a portion of the firstdielectric layer above a top of the vertical structure by using apolymer gas; and laterally etching the sidewall of the first dielectriclayer by using a plasma etching process with a lateral power.
 4. Themethod of claim 1, further comprising: forming a third dielectric layerover the substrate.
 5. The method of claim 1, wherein forming the firstdielectric layer over the vertical structure and the substrate furthercomprises forming the first dielectric layer with at least one of oxide,SiN, SiON, SiC, SiCN and SiOCN.
 6. The method of claim 2, whereinforming the first film layer over the first dielectric layer comprisesforming the first film layer with at least one of poly and an ashableamorphous carbon film.
 7. The method of claim 2, wherein forming thesecond dielectric layer over the first film layer and in the recessfurther comprises forming the second dielectric layer with at least oneof oxide, SiN, SiON, SiC, SiCN and SiOCN.
 8. The method of claim 1,wherein forming the first dielectric layer over the vertical structureand the substrate further comprises forming the first dielectric layerhaving a thickness of 5-40 nanometers.
 9. The method of claim 1, whereinproviding the vertical structure over the substrate further comprisesproviding the vertical structure having a source layer and a channellayer.
 10. The method of claim 1, wherein providing the verticalstructure over the substrate further comprises providing the verticalstructure having a source layer, a drain layer and a channel layer. 11.A method of forming a vertical device, comprising: providing a verticalstructure over a substrate; forming an etch stop layer over the verticalstructure; laterally etching a sidewall of the etch stop layer; forminga first oxide layer over the etch stop layer; performing chemicalmechanical polishing on the first oxide layer and stopping on the etchstop layer; etching back the first oxide layer; forming a first filmlayer over the first oxide layer and the etch stop layer; performingchemical mechanical polishing on the first film layer and stopping onthe etch stop layer; etching a portion of the etch stop layer to exposea top surface of the vertical structure; forming a second oxide layerover the vertical structure and the first film layer; performingchemical mechanical polishing on the second oxide layer and stopping onthe first film layer; etching the first film layer; and etching aportion of the etch stop layer to expose the lateral surface of thevertical structure.
 12. The method of claim 11, wherein laterallyetching the sidewall of the etch stop layer further comprises: forming apolymer layer over a portion of the etch stop layer above the top of thevertical structure by using a polymer gas; and laterally etching thesidewall of the etch stop layer by using a plasma etching process with alateral power.
 13. The method of claim 11, wherein forming the etch stoplayer over the vertical structure further comprises forming the etchstop layer with SiN.
 14. The method of claim 11, wherein forming thefirst film layer over the first oxide layer and the etch stop layerfurther comprises forming the first film layer with at least one of polyand ashable amorphous carbon film.
 15. The method of claim 11, whereinforming the etch stop layer over the vertical structure furthercomprises forming the etch stop layer having a thickness of 5-40nanometers.
 16. The method of claim 11, wherein providing the verticalstructure over the substrate further comprises providing the verticalstructure having a source layer and a channel layer.
 17. The method ofclaim 11, wherein providing the vertical structure over the substratefurther comprises providing the vertical structure having a sourcelayer, a drain layer and a channel layer.
 18. A vertical device,comprising: a source layer, having a protrusion; a trimmed layer,adjacent to the protrusion; a channel layer over the protrusion of thesource; and a drain layer over the channel layer.
 19. The device ofclaim 18, further comprising: an untrimmed layer over a base of thesource layer.
 20. The device of claim 19, wherein the trimmed layer andthe untrimmed layer are formed of SiN.